12″ Auto wafer loader. Fast, safe transfer of wafers for macro and micro inspection
Cassette Type
FOSB (Front Opening Shipping Box)
- SEMI: M31-0999 Standard Product
FOUP (Front Opening Unified Pods)
- SEMI: E47.1-0200 Standard Product
- FIMS-FOSB, FOSB
12" Auto Wafer Loader that Support FOSB cassette
- Olympus continues with their proven expertise in wafer handling with the AL120-12 model. Its robust and reliable design maintains wafer integrity and ensures safe handling for 300mm wafers.
- Transfer of thin and warped wafers can be safely transferred using the AL120-12 handler.
12" Auto Wafer Loader that supports both FOUP and FOSB cassette
The AL120-12 wafer handler is compatible with both FOUP (Load Port) and FOSB, ideal for lower cost back-end inspection. The safe and ergonomic design maintains operator safety while effectively transferring wafers including thin and warped wafers.
- With post-process inspection in mind, particular emphasis has been placed on the ease of use and ergonomics. The AL120-12 system includes top macro, back macro and microscope inspection.
- The robotic vacuum pick-up arm provides non-contact centering of wafer for accurate placement on the microscope stage. Wafers can be rotated 360 degrees during microscope inspection.
- The AL120-12 interfaces with Olympus ' MX63L microscope providing excellent resolution and precision quality optical imaging.
- Centrally located controls and on-board macro illuminator allow operators to maintain an ergonomic and relaxed position, even for long periods of inspection.
| 300mm Wafer Loader AL120-12 Specifications | ||
| AL120-LMB12-LP3 | AL120-LMB12-F | |
| Wafer Size | 300 mm in dia. (SEMI M1.15, t=775 µm) Option: 200 mm in dia. | |
| Cassette | - FOUP (Front Opening Unified Pods) - SEMI: E47.1-0200 Standard Product - FIMS-FOSB, FOSB |
- FOSB (Front Opening Shipping Box) - SEMI: M31-0999 Standard Product |
| Number of Cassettes | One Cassette (for Loading and Unloading) | |
| Cassette Placement Height | 900 mm | |
| Loading Port | Included | Not Included |
| Transfer Sequence | Top Macro Inspection, Back Macro Inspection, Micro Inspection | |
| Inspection Mode | All Wafers Inspection, Sampling Inspection | |
| Wafer Alignment | Non-contact Centering | |
| Wafer Transfer System | Vacuum-contact Mechanical Arm System | |
| Applicable Microscope | Olympus Semiconductor Inspection Microscope MX61L | |
| Utility | AC100V – 120V, 220 – 240V 3.0/1.7A 50/60Hz Vacuum -67kPa – -80kPa Clean dry air 0.5MPa – 0.6MPa |
AC100V – 120V, 220 – 240V 3.0/1.7A 50/60Hz Vacuum -67kPa – -80kPa |
| Stage | XY Manual Contact Stage: XY Coarse/Fine Motion, Included with a 360° Rotating Mechanism | |
| Mass (Excluding the Microscope) | 360 kg approx. | 270 kg approx. |
Specification are subject to change without notice or obligation on the part of the manufacturer
